IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
41
of
73
9.4 X-Ray Analysis and Voiding
Levels of acceptability for voiding depend on the final application of the end product. For
general guidelines regarding voiding, see IPC-7095,
Design and Assembly Process
Implementation for BGA’s
.
Note that the connector design is
ball-on-pin
style. If pins appear as voids during x-ray
analysis, parameters should be adjusted to eliminate the false detection of voids.
9.5 Transmission 2-Dimensional X-Ray
A 2-dimensional x-ray system can be used to verify certain defects that are indicated by the 3-
dimensional inspection, particularly if the interconnections are viewed at oblique angles.
Pins in
centers of
solder joints
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
