IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
37
of
73
The
IT3/IT5
connector system receptacle’s post-reflow standoff height of 0.8 mm and open
body design make it very easy to clean solder paste residues, even with modest cleaning
processes.
Unless specifically mentioned, IT3 and IT5 share the same capability and requirement.
8.1 Water-Washable Solder Process
For water washable solder pastes, washing action is a function of
Temperature, Time and
Agitation
.
Consult with solder paste supplier for
optimum water
temperature
, as some
residues clean better at lower temperatures (45 – 50
o
C) and others clean better at higher
temperatures (60 – 65
0
C). Cleaning
time is a function of belt speed
for in-line cleaning
machines, and can be set manually for most batch cleaners.
Agitation
is the mechanical
scrubbing action of the water, and can be controlled by changing the flow rate, pressure,
number of nozzles or angle of the water delivery system, depending on the type of cleaning
machine used. For most BGA devices, a shallow impingement angle is required to help direct
the cleaning fluid under the package body and aid the cleaning process. The
IT3/IT5
connector’s open body design allows fluid flow from any direction and does not require
shallow impingement angles to ensure fluid penetration.
Belt speed or
manual timer
Impingement
velocity and
angle
45 - 65
o
C
Time
Agitation
Temp
Assembly Cleaning Process
Key Variables
Section 8 Cleaning
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
