IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
48
of
73
10.8 Solder Replenishment
A small metal or flexible polymer stencil should be used to
apply solder paste to the circuit
board.
The stencil should use the same aperture design as the original SMT stencil; 0.54mm
circles are preferred.
A good quality solder paste print is absolutely necessary for successful
rework.
Metal stencils should be positioned over the pads and taped to the PWB along the
edges to hold them in place. Most polymer stencils have residue-free adhesives that will hold
them to the board during the printing process. At this step, proper alignment between the
stencil apertures and the pads is critical.
Some BGA rework procedures include printing paste on the balls of the BGA. Due to the
compliant nature of the ball-on-pin design of the
IT3/IT5
connector,
printing paste directly on
the BGA balls is not recommended.
Precautions:
Solder MUST be applied to the pads during the rework process. Use of
flux alone has been shown to result in reduced reliability of the assembly.
10.9 Receptacle Placement
Receptacle should be
aligned
using the optics on the automated rework system.
Placement force should be minimal
to avoid disturbing the solder deposit.
Metal cap should be used
on 300 position receptacles to maintain stiffness during rework.
Non-Damaged Soldermask Dam
Damaged Soldermask Dam
Allows solder to get
pulled off the pad
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
