IT3/IT5
Connector System
T
IPS FOR
SMT
A
SSEMBLY
Document Number:
ETAD-F0458
Revision 3.10
Page
60
of
73
Paste Prints:
Pri nt-rela ted defects include:
P
ri
n
t
Q
u
a
lit
y
Failure
Mode
Suggested Action
Solder
shorts
Solder shorts a re often from solder pas te smea rs on the bottom of the
rework s tencil . For bes t resul ts :
•
Thoroughl y clean and dry both sides of s tencil and i ts a pertures and
before use
•
Check PWB pads for proper site redressing
•
Tape stencil to PWB to prevent slippage duri ng pri nting
•
Fill a pertures wi th 1-2 strokes of the squeegee blade. Do not go over
s tencil mul tiple ti mes as i t can force unwanted pas te into a reas
between s tencil and PWB
•
After printing, remove tape and pull s tencil strai ght off of PWB. Do
not use peeling motion to remove stencil.
•
Inspect pri nt for sufficient volumes, good defini tion, and alignment
wi th pads
Opens
Opens a re often the result of insuffi cient solder pas te deposi ts.
Following the printing process des cribed above:
•
Make sure all apertures a re completel y filled before removing the
tape from the s tencil .
•
After removing the s tencil from the PWB, check the apertures to
ma ke sure the paste released.
If paste does not release well, check its tempera ture and condi tion. If i t
is too cold, wa rm the paste sample as per the manufa cturer’s di rections .
If i t is dried out from a tmospheri c exposure, disca rd and replace i t.
Precauti ons:
Pri nt solder paste on PWB only
. Do not print pas te on balls. The IT3/5
connector s ys tems use a compliant ball-on-pin design. Printing on the balls ma y affect
thei r alignment.
Alwa ys use solder paste for
IT3/IT5
rework. For ma ximum interconnection
reliability, rework should be performed with solder paste, not flux alone.
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
