EXPRESS DAS
Installation and Operations Manual
16
EXPRESS DAS Installation and Operations Manual – Version 2.2 November 2013
3.2
BIU Components
The BIU is comprised of several components, which are described in detail below.
Figure 3.3 – BIU Components
Unit Name
Product No
Description
Chassis
SC_BIU_SISO
SC_BIU_MIMO
SC_BIU_SISO: Includes MPSU Card, MCPU Card, MCDU
Card,1 MCDU Blank and 2 MDBU Blanks
SC_BIU_MIMO: Includes MPSU Card, MCPU Card and 2
MCDU Cards
Mother Board
Provides signal interface and power for each unit, four
ports for dry contact output,
three ports for input,
two Aux ports for future usage
Main Drive BTS Unit
(MDBU)
SC_MDBU
Amplify & adjust downlink RF signal
Amplify & adjust uplink RF signal
Max. 4 MDBUs in a single BIU
Main Combiner Divider Unit
(MCDU)
SC_MCDU
Combines 4 downlink signals and divides 4 uplink signal to
ODU
Combines 4 uplink signals and divides 4 downlink signals
to MDBU
Supports VHF/UHF interface port
Main Central Processor Unit
(MCPU)
SC_MCPU
Controls and monitors system status
Control and monitoring with USB (B)
Allows access via the Internet through Ethernet port
Main Power Supply Unit
(MPSU)
SC_MPSU
Input power: DC -48V, Output power: 9V, 6V
Blank Card
SC_MCDU_B
Blank card for unused slot
Table 3.3 – BIU Components and Functions
MDBU
#2
MDBU
#1
MDBU
#3
MDBU
#4
SISO Side
MIMO Side
MCDU’s
MPSU
Содержание EXPRESS Single-Carrier DAS
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