Section 25 User Debug Interface (H-UDI)
Rev. 3.00 Jan 25, 2006 page 757 of 872
REJ09B0286-0300
Data loaded into the output pin boundary scan register in the Capture-DR state is not used for
external circuit testing (it is replaced by a shift operation).
•
CLAMP [Instruction code: B'0010]
When the CLAMP instruction is enabled, the output pin outputs the value of the boundary scan
register that has been previously set by the SAMPLE/PRELOAD instruction. While the
CLAMP instruction is enabled, the state of the boundary scan register maintains the previous
state regardless of the state of the TAP controller.
A bypass register is connected between the ETDI and ETDO pins. The related circuit operates
in the same way when the BYPASS instruction is enabled.
•
HIGHZ [Instruction code: B'0011]
When the HIGHZ instruction is enabled, all output pins enter a high-impedance state. While
the HIGHZ instruction is enabled, the state of the boundary scan register maintains the
previous state regardless of the state of the TAP controller.
A bypass register is connected between the ETDI and ETDO pins. The related circuit operates
in the same way when the BYPASS instruction is enabled.
•
IDCODE [Instruction code: B'1110]
When the IDCODE instruction is enabled, the value of the ID code register is output from the
ETDO pin with LSB first when the TAP controller is in the Shift-DR state. While the
IDCODE instruction is being executed, the test circuit does not affect the system circuit.
When the TAP controller is in the Test-Logic-Reset state, the instruction register is initialized
to the IDCODE instruction.
25.5.2
Notes
1. Boundary scan mode does not cover power-supply-related pins (VCC, VCL, VSS,
AVCC/DrVCC, AVSS/DrVSS, and AVref).
2. Boundary scan mode covers clock-related pins (EXTAL, XTAL, X1, and X2).
3. Boundary scan mode does not cover reset- and standby-related pins (
RES
,
STBY
, and
RESO
).
4. Boundary scan mode does not cover H-UDI-related pins (ETCK, ETDI, ETDO, ETMS, and
ETRST
).
5. Fix the
MD2
pin high.
Содержание H8S/2158
Страница 10: ...Rev 3 00 Jan 25 2006 page viii of lii...
Страница 36: ...Rev 3 00 Jan 25 2006 page xxxiv of lii B Product Lineup 863 C Package Dimensions 864 Index 865...
Страница 47: ...Rev 3 00 Jan 25 2006 page xlv of lii Appendix Figure C 1 Package Dimensions TBP 112A 864...
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Страница 70: ...Section 1 Overview Rev 3 00 Jan 25 2006 page 16 of 872 REJ09B0286 0300...
Страница 118: ...Section 3 MCU Operating Modes Rev 3 00 Jan 25 2006 page 64 of 872 REJ09B0286 0300...
Страница 126: ...Section 4 Exception Handling Rev 3 00 Jan 25 2006 page 72 of 872 REJ09B0286 0300...
Страница 198: ...Section 6 Bus Controller Rev 3 00 Jan 25 2006 page 144 of 872 REJ09B0286 0300...
Страница 326: ...Section 10 8 Bit PWM Timer PWM Rev 3 00 Jan 25 2006 page 272 of 872 REJ09B0286 0300...
Страница 440: ...Section 15 Watchdog Timer WDT Rev 3 00 Jan 25 2006 page 386 of 872 REJ09B0286 0300...
Страница 606: ...Section 17 I 2 C Bus Interface IIC Rev 3 00 Jan 25 2006 page 552 of 872 REJ09B0286 0300...
Страница 742: ...Section 19 Multimedia Card Interface MCIF Rev 3 00 Jan 25 2006 page 688 of 872 REJ09B0286 0300...
Страница 744: ...Section 20 Encryption Operation Circuit DES and GF Rev 3 00 Jan 25 2006 page 690 of 872 REJ09B0286 0300...
Страница 750: ...Section 21 D A Converter Rev 3 00 Jan 25 2006 page 696 of 872 REJ09B0286 0300...
Страница 768: ...Section 22 A D Converter Rev 3 00 Jan 25 2006 page 714 of 872 REJ09B0286 0300...
Страница 770: ...Section 23 RAM Rev 3 00 Jan 25 2006 page 716 of 872 REJ09B0286 0300...
Страница 824: ...Section 26 Clock Pulse Generator Rev 3 00 Jan 25 2006 page 770 of 872 REJ09B0286 0300...
Страница 844: ...Section 27 Power Down Modes Rev 3 00 Jan 25 2006 page 790 of 872 REJ09B0286 0300...
Страница 878: ...Section 28 List of Registers Rev 3 00 Jan 25 2006 page 824 of 872 REJ09B0286 0300...
Страница 926: ...Index Rev 3 00 Jan 25 2006 page 872 of 872 REJ09B0286 0300...