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Sequence Recipe and Data - Creating a Sequence Recipe
KLA-Tencor P-16+ / P-6 User’s Guide
6-6
KLA-Tencor Confidential
0142530-000 AB
3/13/09
2.
Click
Pattern Recog. Deskew…
Begin
: Load Die Grid
3.
This sequence is being set up to work on a particular wafer with a set die grid
that is to be measured. The sequences must be connected to the Die Grid for
scanning and navigational purposes.
Die Grid Navigation with single scans requires loading the die grid at the
beginning of each scanning session. With sequences, a die grid can be associated
with a sequence, so that it loads and aligns the wafer automatically when
teaching sites for the sequence. The die grid can also be disassociated if the
sequence no longer requires Die Grid Navigation.
For additional information about the use of Die Grid Navigation, see
Grid Navigation (Optional Feature, P-16+ only) on page 4-16
Ensure that the wafer on the stage has the same pattern as that of the die grid
being loaded.
Figure 6.5
Options Section in the Sequence Editor (Optional feature, P-16+
only)
Click the menu
arrow for its menu.
Choose
Pattern
Recog. Deskew
.
NOTE:
Whenever possible, load a die grid before teaching any sites;
because it invalidates all currently taught positions.
CAUTION:
It is very important that each wafer is placed in the same
orientation that the die grid was taught in. If not, the system cannot
locate the dies. When placing the wafer in the system, it is best to use
a precision locator to place the wafer in the proper orientation.
Содержание P-16+
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