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Scan Recipes - CMP Analysis
KLA-Tencor P-16+ / P-6 User’s Guide
3-82
KLA-Tencor Confidential
0142530-000 AB
3/13/09
Lines
3
For the purposes of this analysis, “lines” is defined as an intermittent
distribution of metal and oxide lines. The metal line are usually a soft metal
like aluminum or copper which typically have polish rates higher than that of
the surrounding array oxide. The basic composition of a sample set of lines is
illustrated in
.
Using the LINES Analysis Routine
3
The LINES routine assumes that the lines are running parallel to each other.
The scan path must be perpendicular to the lines. This routine is designed to
perform analysis on both 2D and 3D Profiler data. The same set of input
parameters are used for 2D and 3D data belonging to a single recipe, e.g., 2D
slices from a 3D data set. The analysis is intended for profiles exhibiting both
recess and erosion. It calculates both erosion and recession.
Analysis Process
The analysis is performed on Normal data as described in the following
sequence:
1.
The “erosion region” (ER) is found by determining the minimum and
maximum slopes in the profile.
2.
The “calculations region” (CR) is defined as some fraction of the ER.
Figure 3.66
Sample Array of Lines
Field Oxide
Array Oxide
– The same
chemical structure as the field
oxide, has faster polish rates due
to presence of the metal lines.
Metal Lines
– CMP polish rates
are typically higher than that of
surrounding array oxide.
CAUTION:
The algorithm assumes that there will be a flat profile at
the beginning of the scan and at the end of the scan. Therefore, the
scan must start in the field oxide and end in the field oxide so that the
required flat regions border the scan target.
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