Intel 810A3, Руководство по конструкции

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Intel
®
810A3 Chipset Design Guide 1-1
Introduction
Introduction
1
This design guide provides motherboard design guidelines for Intel

810A3 chipset systems.
These design guidelines have been developed to ensure maximum flexibility for board designers
while reducing the risk of board related issues. In addition to design guidelines, this document
discusses Intel

810A3 chipset system design issues (e.g., thermal requirements).
The debug recommendations should be consulted when debugging an Intel

810A3 chipset
system; however, the debug recommendations should be understood before completing board
design to ensure that the debug port, in addition to other debug features, will be implemented
correctly.
•
Please note these earlier design guides are still current:
Intel
®
810 Chipset Design Guide, order number 290657, references the Intel
®
82810A2
chipset device for Intel
®
Celeron™ processor 66 MHz Front Side Bus designs.
Intel
®
810E Chipset Platform Design Guide, order number 290675, references the Intel
®
82810E chipset device for the Intel
®
Pentium
®
III
processor 100 MHz / 133 MHz Front Side
Bus designs.
1.1 About This Design Guide
This design guide is intended for hardware designers who are experienced with PC architectures
and board design. The design guide assumes that the designer has a working knowledge of the
vocabulary and practices of PC hardware design.
•
Chapter 1, “Introduction” —This chapter introduces the designer to the organization and
purpose of this design guide, and provides a list of references of related documents. This
chapter also provides an overview of the Intel
®
810A3 chipset.
•
Chapter 2, “PGA370 Processor Design Guidelines” —This chapter provides design guidelines
for the PGA370 processor including processor-specific layout guidelines.
•
Chapter 3, “SC242 Processor Design Guidelines” —This chapter provides design guidelines
for the SC242 processor including processor-specific layout guidelines.
•
Chapter 4, “Layout and Routing Guidelines” —This chapter provides a detailed set of
motherboard layout and routing guidelines, except for processor-specific layout guidelines.
The motherboard functional units are covered (e.g., chipset component placement, system bus
routing, system memory layout, display cache interface, hub interface, IDE, AC’97, USB,
interrupts, SMBUS, PCD, LPC/FWH Flash BIOS, and RTC). For the PGA370 processor
specific layout guidelines, refer to
Chapter 2, “PGA370 Processor Design Guidelines” . For the
SC242 processor spcific layout guidelines, refer to Chapter 3, “SC242 Processor Design
Guidelines” .
•
Chapter 5, “Advanced System Bus Design” —The goal of this chapter is to provide the system
designer with the information needed for the implementation of 133 MHz and 100 MHz
AGTL+ bus PCB layout.
•
Chapter 6, “Clocking” — This chapter provides motherboard clocking guidelines (e.g., clock
architecture, routing, capacitor sites, clock power decoupling, and clock skew).
•
Chapter 7, “System Design Considerations” — This chapter includes guidelines regarding
power deliver, decoupling, thermal, and power sequencing.
•
Chapter 8, “Design Checklist” — This chapter provides a design review checklist. ATA/66
detection, calculation of pullup/pulldown resistors, minimizing RTC ESD, and power
management signals are also discussed.