viii
Intel
®
810A3 Chipset Design Guide
Tables
2-1
Platform Pin Definition Comparison for Single Processor Designs ..............2-2
2-2
Processor Pin Definition Comparison ...........................................................2-3
2-3
Intel
®
Pentium
®
III Processor and GMCH AGTL+ Parameters for
Example Calculations ...................................................................................2-4
2-4
Example T
FLT_MIN
Calculations FOR 100 MHz Bus .....................................2-5
2-5
Example T
FLT_MIN
Calculations (Frequency Independent)...........................2-5
2-6
Segment Descriptions and Lengths for
Figure 2-1
.......................................2-6
2-7
Trace Width (Space Guidelines)...................................................................2-6
2-8
Routing Guidelines for Non-AGTL+ Signals .................................................2-8
2-9
Example Resistor Values for CLKREF Divider Circuit (3.3V Source).........2-10
3-1
Intel
®
Pentium
®
III Processor and GMCH AGTL+ Parameters for
Example Calculations ...................................................................................3-1
3-2
Example T
FLT_MAX
Calculations for 100 MHz Bus .......................................3-2
3-3
Example T
FLT_MIN
Calculations (Frequency Independent)...........................3-2
3-4
Segment Descriptions and Lengths for
Figure 3-2
......................................3-3
3-5
Trace Width:Space Guidelines .....................................................................3-3
3-6
Routing Guidelines for Non-AGTL+ Signals .................................................3-4
4-1
System Memory Routing ..............................................................................4-5
4-2
Display Cache Routing (Topology 1) ............................................................4-8
4-3
Display Cache Routing (Topology 2) ............................................................4-8
4-4
Display Cache Routing (Topology 3) ............................................................4-8
4-5
Display Cache Routing (Topology 4) ............................................................4-9
4-6
AC’97 Configuration Combinations.............................................................4-18
4-7
Recommended USB Trace Characteristics ................................................4-23
4-8
Inductor.......................................................................................................4-30
4-9
Capacitor ....................................................................................................4-30
4-10
Resistor.......................................................................................................4-30
4-11
DPLL LC Filter Component Example..........................................................4-37
4-12
Additional DPLL LC Filter Component Example .........................................4-38
4-13
Resistance Values for Frequency Response Curves (see
Figure 4-38
).....4-39
5-1
Trace Width Space Guidelines .....................................................................5-6
5-2
Host Clock Routing .......................................................................................5-6
6-1
Intel
®
810A3 Chipset Clocks.........................................................................6-1
6-2
Group Skew and Jitter Limits at the Pins of the Clock Chip .........................6-3
6-3
Signal Group and Resistor............................................................................6-3
6-4
Layout Dimensions .......................................................................................6-4
7-1
Intel
®
810A3 Chipset Power Map .................................................................7-3
7-2
Intel
®
810A3 Chipset Voltage Regulator Specifications ...............................7-4
7-3
Power Sequencing Timing Definitions ........................................................7-12
8-1
AGTL+ Connectivity Checklist for 370-Pin Socket Processors.....................8-2
8-2
CMOS Connectivity Checklist for 370-Pin Socket Processors .....................8-3
8-3
TAP Checklist for a 370-Pin Socket Processor ...........................................8-3
8-4
Miscellaneous Checklist for 370-Pin Socket Processors ..............................8-4
8-5
AGTL+ Connectivity Checklist for SC242 Processors ..................................8-5
8-6
CMOS Connectivity Checklist for SC242 Processors...................................8-6
8-7
TAP Checklist for SC242 Processors ...........................................................8-6
8-8
Miscellaneous Checklist for SC242 Processors ...........................................8-6
8-9
Special Consideration Checklist ...................................................................8-7
8-10
Clock Generator Checklist ............................................................................8-7
Содержание 810A3
Страница 1: ...Intel 810A3 Chipset Platform Design Guide July 2000 Order Number 298186 002...
Страница 11: ...1 Introduction...
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Страница 25: ...2 PGA370 Processor Design Guidelines...
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Страница 41: ...3 SC242 Processor Design Guidelines...
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Страница 51: ...4 Layout and Routing Guidelines...
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Страница 115: ...6 Clocking...
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Страница 163: ...A PCI Devices Functions Registers Interrupts...
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