Intel 810A3, Руководство по конструкции

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Design Checklist
8-14 Intel
®
810A3 Chipset Design Guide
+5VSB
If an adequate power supply is available, this pin should be connected to +5Vdual or
+5Vsby. In the event that these planes cannot support the required power, it can be
connected to VCC5 core on the motherboard. An AMR card using this standby/dual
supply should not prevent basic operation if this pin is connected to core power.
S/P-DIF_IN Connect to ground on the motherboard.
AC_SDIN[3:2]
No connect on the motherboard. The ICH supports a maximum of two codecs, which
should be attached to SDIN[1:0].
AC97_MSTRCLK Connect to ground on the motherboard.
PC_BEEP
Should be routed through the audio codec. Care should be taken to avoid the
introduction of a pop when powering the mixer up or down.
Table 8-23. Power Delivery Checklist
Checklist Line Items Comments
All voltage regulator components meet
maximum current requirements
Consider all loads on a regulator, including other regulators.
All regulator components meet thermal
requirements Ensure the voltage regulator components and dissipate the
required amount of heat.
If devices are powered directly from a
dual rail (i.e., not behind a power
regulator), then the RDSon of the FETs
used to create the dual rail must be
analyzed to ensure there is not too much
voltage drop across the FET.
“Dual” voltage rails may not be at the expected voltage.
Dropout Voltage
The minimum dropout for all voltage regulators must be
considered. Take into account that the voltage on a dual rail may
not be the expected voltage.
Voltage tolerance requirements are met See individual component specification for each voltage tolerance.
Total power consumption in S3 must be
less than the rated standby supply
current.
Adequate power must be supplied by power supply.
Table 8-22. AC’97 Checklist (Continued)
Checklist Line Items Comments