Intel
®
810A3 Chipset Design Guide
4-31
Layout and Routing Guidelines
4.14.5
Custom Solutions
As long as filter performance as specified in
Figure 4-30
and other requirements outlined in
Section 4.14.3, “Filter Specification” on page 4-28
are satisfied, other solutions are acceptable.
Custom solutions should be simulated against a standard reference core model, which is shown in
Figure 4-33
.
NOTES:
1. 0.1
Ω
resistors represent package routing
1
.
2. 120 pF capacitor represents internal decoupling capacitor.
3. 1 K
Ω
resistor represents small signal PLL resistance.
4. Be sure to include all component and routing parasitics.
5. Sweep across component/parasitic tolerances.
6. To observe IR drop, use DC current of 30 mA and minimum VCC
CORE
level.
Figure 4-32. No Discrete R
L
C
<0.1 ohm route
PLL2
PLL1
370-Pin
Socket
<0.1 ohm route
VCC
CORE
Trace Resistance
Figure 4-33. Core Reference Model
PLL1
PLL2
Processor
0.1 ohm
120pF
1K ohm
0.1 ohm
1.
For other modules (interposer, DMM, etc), adjust routing resistor if desired, but use minimum numbers.
Содержание 810A3
Страница 1: ...Intel 810A3 Chipset Platform Design Guide July 2000 Order Number 298186 002...
Страница 11: ...1 Introduction...
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Страница 25: ...2 PGA370 Processor Design Guidelines...
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Страница 41: ...3 SC242 Processor Design Guidelines...
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Страница 51: ...4 Layout and Routing Guidelines...
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Страница 93: ...5 Advanced System Bus...
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Страница 115: ...6 Clocking...
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Страница 123: ...7 System Design Considerations...
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Страница 157: ...9 Third Party...
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Страница 163: ...A PCI Devices Functions Registers Interrupts...
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