Intel 810A3, Руководство по конструкции

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SC242 Processor Design Guidelines
3-8 Intel
®
810A3 Chipset Design Guide
NOTE: NOTE: DRAWING NOT TO SCALE
It is not recommended to use the GRM without the minimum size ground pads in the correct
locations. If the GRM is used without the correct pads, then there is a high risk that the metal clip
that grounds to the motherboard will be touching the solder mask on the top layer of the board, and
possibly short out traces immediately beneath the solder mask, resulting in board failure. The
required thickness of the pad is less than 0.001” (using 1/2 oz copper).
Figure 3-5. Detailed Drawing of Minimum Ground Pad Size and Location
0 . 1 8 2
G r o u n d P a d A r e a s ,
See Detail A
N o t e s :
1. All dimensions are in inches and all
tolerances are ±0.004, unless otherwise
specified.
2. Retention mechnasim must stay within
X-Hatch area.
3. Entire specified plating area must be plated
and grounded with a minum of eight VIAS.
H e a t S i n k A r e a
0 . 3 6 4
∅
0.15
2
+0.0
0 . 4 6 4
0 . 2 3 2
Detail A