IBM 6219 - IntelliStation M - Pro, Руководство по конфигурации и настройкам, Страница: 129 / 317

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For the latest product & technical information, refer to the Information Sources on pages 2 and 3. Updated 12/03/02
xSeries 255 Processor Upgrades
Part
Number
Processor Upgrades SMP
Support
1
Processor
Speed
Upgrade
2
59P5111 xSeries 1.4GHz/400MHz-512KB Xeon MP Processor Option 1xX -
59P5106 xSeries 1.5GHz/400MHz-512KB Xeon MP Processor Option 2xX 1xX
59P5107 xSeries 1.6GHz/400MHz-1MB Xeon MP Processor Option 3xX 1xX, 2xX
59P6815 1.5GHz/400MHz-1MB L3 Cache Xeon Processor MP 4xX -
59P6816 1.9GHz/400MHz-1MB L3 Cache Xeon Processor MP 5xX 4xX
59P6817 2GHz/400MHz-2MB L3 Cache Xeon Processor MP 6xX 4xX, 5xX
1. Three additional processors may be installed, providing a maximum of four. All processors must be identical in type, speed,
and cache size. See diagram for order of installation.
2. Requires removal of the standard processor. A maximum of four processors may be installed (see xSeries 255 planar
diagram for order of installation). All processors must be identical in type, speed and cache size. Upgrades may require a BIOS
update. To obtain the latest Flash BIOS, access www.pc.ibm.com/support and enter machine “Type-Model” in Quick Path.
Select “Downloadable files” and then “BIOS.”
xSeries 255 Memory
Part
Number Memory Description
33L3281 256MB PC1600 ECC DDR SDRAM RDIMM
33L3283 512MB PC1600 ECC DDR SDRAM RDIMM
33L3285 1GB PC1600 ECC DDR SDRAM RDIMM
1. To support two-way interleaving, optional RDIMMs must be installed in pairs up to a maximum of six
RDIMMs including the standard RDIMMs. To support four-way interleaving, the first two optional RDIMMs are
installed to complete one four-way set, then the next two sets are installed, each of which includes four
matching RDIMMs. All RDIMMs in a set must be the same density and technology, but the sets are not
required to match other sets. Four-way interleaving provides improved performance benefits over two-way
interleaving. Chipkill support is provided on the memory card. See RDIMM Order of Installation table below.
RDIMM Order of Installation and Hot Spare Memory Configuration
Interleaving
Quantity of
RDIMMs RDIMM Set Bank Hot Spare Memory
2
2-way
1
2 D2, D8 3 -
2-way 4 D4, D10 2 Bank 3
2-way 6 D6, D12 1 Bank 3
4-way
2
4 D1, D2, D7, D8 3 -
4-way 8 D3, D4, D9, D10 2 Bank 3
4-way 12 D5, D6, D11, D12 1 Bank 3
1. Two RDIMMs installed in D2 and D8 are standard in base models with two-way interleaving enabled. If two-way interleaving is maintained, then a pair of RDIMMs can be installed in D4 and
D8 and two more in D6 and D12. If four-way interleaving is enabled, RDIMMs must be added in D1 and D7 to complete Bank 3, then four RDIMMs are added in Bank 2 and four more
RDIMMs can be added in Bank 1
2. If Hot Spare Memory is enabled by the system BIOS, memory bank 3 is used as a spare bank in the event of RDIMM failure. Bank 3 serves as a hot spare for both banks 1 and 2. Hot Spare
Memory does not apply when only two RDIMMs are installed or when only four RDIMMs are installed with four-way interleaving. Hot Spare Memory is not addressable by the CPU until
activated. Memory density and technology must be the same in both the active and spare banks.
rear
top view of x255 planar
front
CP
U
1
CP
U2
CP
U4
CP
U3
D1
D2
D3
D4
D6
D5
D7
D8
D9
D10
D12
D11
x255 memory riser card