Phytec phyCORE-i.MX 6, Hardware Manual

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Conventions, Abbreviations and Acronyms
©
PHYTEC Messtechnik GmbH 2016 L-808e_2
vii
Abbreviations and Acronyms
Many acronyms and abbreviations are used throughout this manual. Use the table below to
navigate unfamiliar terms used in this document.
Abbreviation Definition
BSP Board Support Package (Software delivered with the Development Kit
including an operating system (Windows, or Linux) preinstalled on the
module and Development Tools).
CB Carrier Board; used in reference to the phyCORE Development Kit Carrier
Board.
DFF D flip-flop.
EMB External memory bus.
EMI Electromagnetic Interference.
GPI General purpose input.
GPIO General purpose input and output.
GPO General purpose output.
IRAM Internal RAM; the internal static RAM on the NXP® Semiconductor i.MX 6
microcontroller.
J Solder jumper; these types of jumpers require solder equipment to
remove and place.
JP Solderless jumper; these types of jumpers can be removed and placed by
hand with no special tools.
PCB Printed circuit board.
PDI PHYTEC Display Interface; defined to connect PHYTEC display adapter
boards, or custom adapters
PEB PHYTEC Extension Board
PMIC Power management IC
PoE Power over Ethernet
POR Power-on reset
RTC Real-time clock.
SMT Surface mount technology.
SOM System on Module; used in reference to the PCM-058 /phyCORE
®
-i.MX 6
module
Sx User button Sx (e.g. S1, S2, etc.) used in reference to the available user
buttons, or DIP-Switches on the carrier board.
Sx_y Switch y of DIP-Switch Sx; used in reference to the DIP-Switch on the
carrier board.
Table 2: Abbreviations and Acronyms used in this Manual