Phytec phyCORE-i.MX 6, Hardware Manual

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phyCORE
®
-i.MX 6 [PCM-058]
62 ©
PHYTEC Messtechnik GmbH 2016 L-808e_2
18.2 Handling the phyCORE-i.MX 6
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Modifications on the phyCORE Module
Removal of various components, such as the microcontroller and the standard quartz, is
not advisable given the compact nature of the module. Should this nonetheless be
necessary, please ensure that the board as well as surrounding components and sockets
remain undamaged while de-soldering. Overheating the board can cause the solder pads
to loosen, rendering the module inoperable. Carefully heat neighboring connections in
pairs. After a few alternations, components can be removed with the solder-iron tip.
Alternatively, a hot air gun can be used to heat and loosen the bonds.
Caution!
If any modifications to the module are performed, regardless of their nature, the
manufacturer guarantee is voided.
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Integrating the phyCORE into a Target Application
Successful integration in user target circuitry greatly depends on the adherence to the
layout design rules for the GND connections of the phyCORE module. For maximum EMI
performance we recommend as a general design rule to connect all GND pins to a solid
ground plane. But at least all GND pins neighboring signals which are being used in the
application circuitry should be connected to GND.