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Page 4-4
A point
A point
B point
B point
A point
A point
1 point
1 point
1 pair
1 pair
Summary of Data Editing
4-1-2
Flow Chart of Data Editing
L
W
T
X
Y
T
1.
2.
5.
6.
3.
4.
7.
Printing conditions data (Library)
When creating new data, set them according
to the solder type and the production quality.
1. Outline of board data
(Board data, Recognition data, Positioning
data)
Input the data of the board to be printed.
2. Mask Data
Input the size of the mask and the plate-making
reference.
X
Y
T
3. Batch teaching data
This data is necessary for positioning the mask and
the board by using the board recognition mark.
3. Mask recognition data
Input the data necessary for positioning the mask
and the board.
When not using the batch teaching When using the batch teaching
L
W
T
193C-E-EMA04-A01-02
Summary of Contents for KXF-193C
Page 2: ......
Page 10: ...Page 10 193C E EMA00 A02 01 INDEX AppendixA RECOGNITION DEVICE ...
Page 32: ...Page 32 193C E EMA00 A04 01 MEMO ...
Page 46: ...Page 1 14 193C E EMA01 A01 01 MEMO ...
Page 80: ...Page 3 26 193C E EMA03 A02 01 MEMO ...
Page 128: ...Page 4 48 193C E EMA04 A03 01 MEMO ...
Page 158: ...Page 5 30 193C E EMA05 A01 01 MEMO ...
Page 176: ...Page 6 18 193C E EMA06 A01 01 MEMO ...
Page 192: ...Page 7 16 193C E EMA07 A01 01 MEMO ...
Page 202: ...Page 8 10 193C E EMA08 A01 01 MEMO ...
Page 206: ...Page 4 193C E EMA0Z A01 01 MEMO ...