Panasonic KXF-193C, Operating Manual

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Page 4-30
Printing Conditions Data
Mask cleaning
Dry cleaning : Removes solder balls and flux (from the aperture and the back of mask).
Wet cleaning : Removes the thin-film-like residual flux (from the back of mask).
NOTICE
When using the wet cleaning, it is recommended to set it for the “Forward” motion
of the second cleaning in 2-round cleaning mode.
If the wet cleaning is used in 1-round cleaning mode, the cleaning performance
may be insufficient depending on the type of solder.
Recommended conditions for mask cleaning
• Cleaning tact time (For the case where board
size is 460 X 360)
1 round: About 26 s
2 round: About 50 s
∗
If the cleaning performance is not good using
the conditions on the left, reduce the cleaning
speed more.
Forward
Backward
Forward
Backward
Dry
Dry
Wet
Dry
1
2
Removes solder balls and flux.
Removes the thin-film-like residual flux.
∗
Solder paste
= Solder balls + Flux
Forward
Backward
Forward
Backward
60
60
30
60
1
2
Dry
Dry
Damp
Dry
ON
ON
OFF
ON
Speed
mm/s
Mothod
Suction
193C-E-EMA04-A03-00
Removes remaining solvent.