Panasonic KXF-193C, Operating Manual

Page: 109 / 206

Pag 4-29
DA
T
A
MODIFICA
TION
4
Printing Conditions Data
4-9-3 Cleaning Data
1. Motion mode
Choose 1-round cleaning or 2-round cleaning for the periodic cleaning.
2. Cleaning motion
Choose whether or not to perform the cleaning motion on the board-contacting side of the mask.
3. Interval
Set the board printing count that shows the interval of cleaning motion.
4. Cleaning during wait of process
Choose whether or not to perform the cleaning motion during waiting time, such as while waiting for
the next process, etc.
5. Waiting time
Input the waiting time until the cleaning-during-wait of process starts.
6. Speed
Set the speed of the cleaning motion.
7. Method
Choose a cleaning method from either the wet or dry process.
∗
Choose the wet process, only in order to remove the flux of solder on the mask. The wet process
is not available for the backward cleaning motion.
8. Suction
Choose whether or not to perform the suction function during the cleaning motion in order to
prevent the mask aperture from being clogged with solder. But, when the wet process is chosen,
the suction function can not be performed.
193C-E-EMA04-A03-00