Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor, Design Manual

Page: 7 / 128

Thermal and Mechanical Design Guidelines 7
Figure 7-22. Third Tape Installation ...................................................................94
Figure 7-23. Measuring Resistance between Thermocouple and IHS .......................95
Figure 7-24. Applying Flux to the Thermocouple Bead ..........................................96
Figure 7-25. Cutting Solder ..............................................................................96
Figure 7-26. Positioning Solder on IHS ...............................................................97
Figure 7-27. Solder Station Setup .....................................................................98
Figure 7-28. View Through Lens at Solder Station................................................99
Figure 7-29. Moving Solder back onto Thermocouple Bead ....................................99
Figure 7-30. Removing Excess Solder .............................................................. 100
Figure 7-31. Thermocouple placed into groove .................................................. 101
Figure 7-32. Removing Excess Solder .............................................................. 101
Figure 7-33. Filling Groove with Adhesive ......................................................... 102
Figure 7-34. Application of Accelerant .............................................................. 102
Figure 7-35. Removing Excess Adhesive from IHS ............................................. 103
Figure 7-36. Finished Thermocouple Installation ................................................ 103
Figure 7-37. Thermocouple Wire Management................................................... 104
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified . 106
Figure 7-39. Thermal sensor Location Illustration .............................................. 107
Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1 .............................. 112
Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2 .............................. 113
Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3 .............................. 114
Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1 ........................ 115
Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2 ........................ 116
Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3 ........................ 117
Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4 ........................ 118
Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5 ........................ 119
Figure 7-48. ATX Reference Clip – Sheet 1........................................................ 120
Figure 7-49. ATX Reference Clip - Sheet 2 ........................................................ 121
Figure 7-50. Reference Fastener - Sheet 1........................................................ 122
Figure 7-51. Reference Fastener - Sheet 2........................................................ 123
Figure 7-52. Reference Fastener - Sheet 3........................................................ 124
Figure 7-53. Reference Fastener - Sheet 4........................................................ 125
Figure 7-54. Intel
®
E18764-001 Reference Solution Assembly ............................. 126