Mechanical Drawings
126
Ther
mal and Mechanical Desig
n Guidelines
Figure 7-54. Intel
®
E
18764-001 Reference Solution A
ssembly
E18764
E18764-00X
BOXED PROCESSOR FAN HEATSINK
CPG
A
4
B
3
C
D
43
21
A
2
C
1
D
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
DWG. NO.
SH.
REV.
FINISH:
MATERIAL:
DESIGNED BY
DRAWN BY
CHECKED BY
APPROVED BY
DATE
DATE
DATE
DATE
DO NOT SCALE DRAWING
SCALE: 1:1
SHEET 1 OF 1
DRAWING NUMBER
CAGE CODE
SIZE
C
TITLE
DEPARTMENT
R
REV
5000 W. CHANDLER BLVD.
CHANDLER, ARIZONA 85226
THIRD ANGLE PROJECTION
1
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN MILIMETERS.
TOLERANCES:
NO DECIMAL PLACES:
ANGLES:
ONE DECIMAL PLACE: TWO DECIMAL PLACES:
INTERPRET DIM AND TOL PER
ASME Y14.5M-1994.
REVISION HISTORY
ZONE
REV.
DESCRIPTION
DATE
APPROVED
FAN TYPE
LINEARLY VARIABLE DC
MASS
250 GRAMS
SOUND LEVEL
HIGH SET POINT: 35 dBA
LOW SET POINT: 25 dBA
MINIMUM SPEED AT LOW PWM - 1000 RPM
46.0
1.81
90.0
3.54
THERMAL INTERFACE MATERIAL
DOW TC-1996 (PRE-APPLIED)
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
