Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
93
Figure
7-19. Thermocouple Bead Placement
(A)
(B)
10.
Place the package under the microscope to continue with process. It is also
recommended to use a fixture (like processor tray or a plate) to help holding the
unit in place for the rest of the attach process.
11.
While still at the microscope, press the wire down about 6mm [0.125”] from the
thermocouple bead using the tweezers or your finger. Place a piece of Kapton*
tape to hold the wire inside the groove (Figure
detailed bead placement.
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
