Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
97
Figure
7-26. Positioning Solder on IHS
17.
Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section
D.5.1.step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3
Solder Process
18.
Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature
19.
Verify the temperature of the Heater block station has reached 155° C ±5° C
before you proceed.
20.
Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
