LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines
73
Figure
7-6. Board Deflection Definition
d1
d2
d’1
d’2
A.3.2
Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
d_BOL – d_ref
≥
0.09 mm and d_EOL – d_ref
≥
0.15 mm
And
d’_BOL – d’_ref
≥
0.09 mm and d_EOL’ – d_ref’
≥
0.15 mm
NOTES:
1.
The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2.
Board deflection should not exceed motherboard manufacturer specifications.
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
