Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
95
12.
Place a 3
rd
piece of tape at the end of the step in the groove as shown in
7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13.
Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section
Figure
7-23. Measuring Resistance between Thermocouple and IHS
14.
Using a fine point device, place a small amount of flux on the thermocouple bead.
Be careful not to move the thermocouple bead during this step (Figure
Ensure the flux remains in the bead area only.
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
