Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor, Design Manual

Page: 90 / 128

Case Temperature Reference Metrology
90 Thermal and Mechanical Design Guidelines
The orientation of the groove at 6 o’clock exit relative to the package pin 1 indicator
(gold triangle in one corner of the package) is shown in Figure
7-14 for the 775-Land
LGA package IHS.
Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package
When the processor is installed in the LGA775 socket, the groove is parallel to the
socket load lever, and is toward the IHS notch as shown Figure
7-15.
Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the LGA775 Socket
Select a machine shop that is capable of holding drawing specified tolerances. IHS
groove geometry is critical for repeatable placement of the thermocouple bead,
ensuring precise thermal measurements. The specified dimensions minimize the
impact of the groove on the IHS under the socket load. A larger groove may cause the
IHS to warp under the socket load such that it does not represent the performance of
an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Pin1 indicator
IHS Groove