ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
53
6
ATX Thermal/Mechanical
Design Information
6.1
ATX Reference Design Requirements
This chapter will document the requirements for an active air-cooled design, with a
fan installed at the top of the heatsink. The thermal technology required for the
processor.
The Intel Core™2 Duo processor E8000, E7000 series, Intel Pentium dual-core
processor E6000, E5000 series, and Intel
®
Celeron
®
processor E3x00 series require a
thermal solution equivalent to the E18764-001 reference design; see Figure 6-1 for an
exploded view of this reference design.
Note:
The part number E18764-001 provided in this document is for reference only. The
revision number -001 may be subject to change without notice.
The E18764-001 reference design takes advantage of an acoustic improvement to
reduce the fan speed to show the acoustic advantage (its acoustic results show in the
Table
The E18764-001 reference design takes advantage of the cost savings for the several
features of the design including the reduced heatsink height, inserted aluminum core
and the new TIM material (Dow Corning TC-1996 grease), see Figure 6-2. The overall
46mm height thermal solution supports the unique and smaller desktop PCs including
small and ultra small form factors, down to the 5L size, see
uATX SFF Guidance
for
additional details on uATX SFF design.
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
