Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines
49
5.4
Safety Requirements
Heatsink and attachment assemblies shall be consistent with the manufacture of units
that meet the safety standards:
UL Recognition-approved for flammability at the system level. All mechanical and
thermal enabling components must be a minimum UL94V-2 approved.
CSA Certification. All mechanical and thermal enabling components must have
CSA certification.
All components (in particular the heatsink fins) must meet the test requirements
of UL1439 for sharp edges.
If the International Accessibility Probe specified in IEC 950 can access the moving
parts of the fan, consider adding safety feature so that there is no risk of personal
injury.
5.5
Geometric Envelope for Intel Reference BTX
Thermal Module Assembly
Appendix G gives the motherboard keep-out
information for the BTX thermal mechanical solutions. Additional information on BTX
design considerations can be found in
Balanced Technology Extended (BTX) System
Design Guide
availablThe maximum height of the TMA above the motherboard is 60.60 mm [2.386 inches],
for compliance with the motherboard primary side height constraints defined in the
BTX Interface Specification
for Zone A, found at
http://www.formfactors.org
.
Figure
5-4. Intel Type II TMA 65W Reference Design
Development vendor information for the Intel Type II TMA Reference Solution is
provided in
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
