Thermal and Mechanical Design Guidelines
5
Board and System Implementation of Intel
QST......................................68
QST Configuration & Tuning..........................................................70
QST ........................................................70
LGA775 Socket Heatsink Considerations ..................................................71
Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
Reference Design .................................................................71
Heatsink Preload Requirement Limitations................................................71
Motherboard Deflection Metric Definition.....................................72
Board Deflection Limits ............................................................73
Board Deflection Metric Implementation Example.........................74
Additional Considerations .........................................................75
Motherboard Stiffening Considerations .........................76
Heatsink Selection Guidelines.................................................................76
Heatsink Preparation................................................................77
Typical Test Equipment ............................................................80
Test Procedure Examples.......................................................................80
Time-Zero, Room Temperature Preload Measurement...................81
Preload Degradation under Bake Conditions ................................81
Bond Line Management .........................................................................83
Interface Material Area..........................................................................83
Interface Material Performance...............................................................83
Case Temperature Reference Metrology..............................................................85
Objective and Scope .............................................................................85
Supporting Test Equipment....................................................................85
Thermal calibration and controls.............................................................87
Thermocouple Attach Procedure .............................................................91
Thermocouple Conditioning and Preparation ................................91
Thermocouple Attachment to the IHS .........................................92
Solder Process ........................................................................97
Cleaning & Completion of Thermocouple Installation................... 100
Thermocouple Wire Management .......................................................... 104
Balanced Technology Extended (BTX) System Thermal Considerations.................. 105
Enabled Reference Solution Information .................................................. 127
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...