Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
101
Figure
7-31. Thermocouple placed into groove
29.
Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (Figure
Figure
7-32. Removing Excess Solder
Note:
Take usual precautions when using open blades
30.
Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
31.
Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (Figure
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
