Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor, Design Manual

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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
44 Thermal and Mechanical Design Guidelines
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion
0.000
0.050
0.100
0.150
0.200
0.250
0.300
0.350
0.400
0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0
Airflow (cfm )
dP
(
in
.
H
2
O
)
Reference TMA @ 5300 RPM
Reference TMA @ 2500 RPM
Reference TMA @ 1200 RPM
5.1.4 Voltage Regulator Thermal Management
The BTX TMA is integral to the cooling of the processor voltage regulator (VR). The
reference design TMA will include a flow partitioning device to ensure an appropriate
airflow balance between the TMA and the VR. In validation the need for this
component will be evaluated.
The BTX thermal management strategy relies on the Thermal Module to provide
effective cooling for the voltage regulator (VR) chipset and system memory
components on the motherboard. The Thermal Module is required to have features
that allow for airflow to bypass the heatsink and flow over the VR region on both the
primary and secondary sides of the board. The following requirements apply to VR
cooling.
Table
5–3. VR Airflow Requirements
Item Target
Minimum VR bypass airflow for
775_VR_CONFIG_06 processors 2.4 CFM
NOTES:
1. This is the recommended airflow rate that should be delivered to the VR when the VR
power is at a maximum in order to support the 775_VR_CONFIG_06 processors at TDP
power dissipation and the chassis external environment temperature is at 35 ºC. Less
airflow is necessary when the VR power is not at a maximum or if the external ambient
temperature is less than 35 ºC.
2. This recommended airflow rate is based on the requirements for the Intel 965 Express
Chipset Family.