Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor, Design Manual

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Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines 15
2 Processor Thermal/Mechanical
Information
2.1 Mechanical Requirements
2.1.1 Processor Package
The processors covered in the document are packaged in a 775-Land LGA package
that interfaces with the motherboard using a LGA775 socket. Refer to the datasheet
for detailed mechanical specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center
of the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide .
The package includes an integrated heat spreader (IHS) that is shown in Figure 2-1
for illustration only. Refer to the processor datasheet for further information. In case
of conflict, the package dimensions in the processor datasheet supersedes dimensions
provided in this document.
Figure 2-1. Package IHS Load Areas
To p S u rfa c e o f IH S
to i n s ta ll a h e a ts i n k
IH S S te p
to i n te rfa c e w i th LGA7 75
S o c k e t Lo a d P la te
S u b s tra te
To p S u rfa c e o f IH S
to i n s ta ll a h e a ts i n k
IH S S te p
to i n te rfa c e w i th LGA7 75
S o c k e t Lo a d P la te
S u b s tra te