Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor, Design Manual

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4 Thermal and Mechanical Design Guidelines
4.2.5 On-Demand Mode ...................................................................37
4.2.6 System Considerations.............................................................37
4.2.7 Operating System and Application Software Considerations ...........38
4.2.8 THERMTRIP# Signal.................................................................38
4.2.9 Cooling System Failure Warning ................................................38
4.2.10 Digital Thermal Sensor.............................................................38
4.2.11 Platform Environmental Control Interface (PECI)..........................39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ........41
5.1 Overview of the BTX Reference Design ....................................................41
5.1.1 Target Heatsink Performance ....................................................41
5.1.2 Acoustics ...............................................................................42
5.1.3 Effective Fan Curve .................................................................43
5.1.4 Voltage Regulator Thermal Management.....................................44
5.1.5 Altitude..................................................................................45
5.1.6 Reference Heatsink Thermal Validation .......................................45
5.2 Environmental Reliability Testing ............................................................45
5.2.1 Structural Reliability Testing .....................................................45
5.2.1.1 Random Vibration Test Procedure................................45
5.2.1.2 Shock Test Procedure ................................................46
5.2.2 Power Cycling .........................................................................47
5.2.3 Recommended BIOS/CPU/Memory Test Procedures ......................48
5.3 Material and Recycling Requirements ......................................................48
5.4 Safety Requirements ............................................................................49
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly........49
5.6 Preload and TMA Stiffness .....................................................................50
5.6.1 Structural Design Strategy........................................................50
5.6.2 TMA Preload verse Stiffness ......................................................50
6 ATX Thermal/Mechanical Design Information.......................................................53
6.1 ATX Reference Design Requirements .......................................................53
6.2 Validation Results for Reference Design ...................................................55
6.2.1 Heatsink Performance ..............................................................55
6.2.2 Acoustics ...............................................................................56
6.2.3 Altitude..................................................................................56
6.2.4 Heatsink Thermal Validation .....................................................57
6.3 Environmental Reliability Testing ............................................................57
6.3.1 Structural Reliability Testing .....................................................57
6.3.1.1 Random Vibration Test Procedure................................57
6.3.1.2 Shock Test Procedure ................................................58
6.3.2 Power Cycling .........................................................................59
6.3.3 Recommended BIOS/CPU/Memory Test Procedures ......................60
6.4 Material and Recycling Requirements ......................................................60
6.5 Safety Requirements ............................................................................61
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......61
6.7 Reference Attach Mechanism..................................................................62
6.7.1 Structural Design Strategy........................................................62
6.7.2 Mechanical Interface to the Reference Attach Mechanism ..............63
7 Intel
®
Quiet System Technology (Intel
®
QST) .....................................................65
7.1 Intel
®
QST Algorithm ............................................................................65
7.1.1 Output Weighting Matrix ..........................................................66
7.1.2 Proportional-Integral-Derivative (PID) ........................................66