Thermal Metrology
28
Thermal and Mechanical Design Guidelines
CS
is strongly dependent on the thermal conductivity and thickness of the TIM
between the heatsink and IHS.
SA
is a measure of the thermal characterization parameter from the bottom of the
heatsink to the local ambient air.
SA
is dependent on the heatsink material, thermal
conductivity, and geometry. It is also strongly dependent on the air velocity through
the fins of the heatsink.
3-1 illustrates the combination of the different thermal characterization
parameters.
Figure
3-1. Processor Thermal Characterization Parameter Relationships
TIM
T
S
T
A
CA
LGA775 Socket
Processor
IHS
System Board
T
C
Heatsink
TIM
T
S
T
A
CA
LGA775 Socket
Processor
IHS
System Board
T
C
Heatsink
3.1.1
Example
The cooling performance,
CA,
is defined using the principle of thermal characterization
parameter described above:
The case temperature T
C-MAX
and thermal design power TDP given in the processor
datasheet
.
Define a target local ambient temperature at the processor, T
A
.
Since the processor thermal profile applies to all processor frequencies, it is important
to identify the worst case (lowest
CA
) for a targeted chassis characterized by T
A
to
establish a design strategy.
The following provides an illustration of how one might determine the appropriate
performance targets. The example power and temperature numbers used here are not
related to any specific Intel processor thermal specifications, and are for illustrative
purposes only.
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
