ATX Thermal/Mechanical Design Information
54
Thermal and Mechanical Design Guidelines
Figure 6-1. E18764-001 Reference Design – Exploded View
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease
The ATX motherboard keep-out and the height recommendations defined Section
remain the same for a thermal solution for the processor in the 775-Land LGA
package.
Note:
If this fan design is used in your product and you will deliver it to end use customers,
you have the responsibility to determine an adequate level of protection (e.g.,
protection barriers, a cage, or an interlock) against contact with the energized fan by
the user during user servicing.
Note:
Development vendor information for the reference design is provided in
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
