Case Temperature Reference Metrology
98
Thermal and Mechanical Design Guidelines
Figure
7-27. Solder Station Setup
21.
Remove the land side protective cover and place the device to be soldered in the
solder station. Make sure the thermocouple wire for the device being soldered is
exiting the heater toward you.
Note:
Do
not
touch the copper heater block at any time as this is very hot.
22.
Move a magnified lens light close to the device in the solder status to get a better
view when the solder begins to melt.
23.
Lower the Heater block onto the IHS. Monitor the device IHS temperature during
this step to ensure the maximum IHS temperature is not exceeded.
Note:
The target IHS temperature during reflow is 150° C ±3° C. At no time should the IHS
temperature exceed 155° C during the solder process as damage to the device may
occur.
24.
You may need to move the solder back toward the groove as the IHS begins to
heat. Use a fine tip tweezers to push the solder into the end of the groove until a
solder ball is built up (Figure
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
