Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines
103
Figure
7-35. Removing Excess Adhesive from IHS
33.
Using a blade, carefully shave any adhesive that is above the IHS surface
(Figure
7-35). The preferred method is to shave from the edge to the center of the
IHS.
Note:
The adhesive shaving step should be performed while the adhesive is partially cured,
but still soft. This will help to keep the adhesive surface flat and smooth with no pits
or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a
second time.
34.
Clean IHS surface with IPA and a wipe.
35.
Clean the LGA pads with IPA and a wipe.
36.
Replace the land side cover on the device.
37.
Perform a final continuity test.
38.
Wind the thermocouple wire into loops and secure or if provided by the vendor
back onto the plastic roll. (Figure
Figure
7-36. Finished Thermocouple Installation
39.
Place the device in a tray or bag until it’s ready to be used for thermal testing use.
Summary of Contents for BX80570E8200 - Core 2 Duo 2.66 GHz Processor
Page 10: ...10 Thermal and Mechanical Design Guidelines...
Page 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Page 82: ...Heatsink Clip Load Metrology 82 Thermal and Mechanical Design Guidelines...
Page 84: ...Thermal Interface Management 84 Thermal and Mechanical Design Guidelines...
Page 110: ...Fan Performance for Reference Design 110 Thermal and Mechanical Design Guidelines...
