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board. Data from the sensor is used to control the fan speed and to initiate system overtemperature
shutdown.
Nonoperating Environment
The system is designed to withstand ambient temperatures between -40°C to 70°C under
nonoperating conditions.
Cooling
This section provides information on the cooling systems in the server.
CPU and Memory Cooling
The server incorporates front to back airflow across the processor and memory extender boards
and through the HDD backplane. Two 127 mm dual fan assemblies, mounted vertically in the
center of the chassis, pull air through the processor and memory section and push air through
the PCI section. Each processor and memory dedicated dual fan assembly is controlled by smart
fan control circuits embedded in the system I/O board. The smart fan control circuit receives fan
control input from the system fan controller in the I/O board, and returns fan status information
to the system fan controller. The smart fan circuit controls the power and the
pulse-width-modulated control signal to the fan and monitors the speed indicator back from
each of the fans. The fan status LED is driven by the smart fan circuit. The fan status LED is
located on the diagnostic board inside the system.
Bulk Power Supply Cooling
Cooling for the bulk power supplies is provided by one 120 mm dual fan assembly and one
externally mounted 60 mm power supply fan. Air is pushed into both power supply bays by the
120 mm fan assembly and exhausted out the rear by the 60 mm fan (one per power supply).
Air flows out of the rear of the chassis with minimal leakage into the cell airflow plenum.
NOTE:
A power supply filler is required in the unused power supply slot to maintain proper
airflow throughout the system.
PCI and Mass Storage Section Cooling
Two dual fan assemblies located at the center of the chassis provide airflow for all the PCI slots.
Air flows over the processor and memory extender boards and into the PCI section. The fans are
controlled by the system temperature and run at the speed necessary to maintain proper internal
temperature throughout the chassis. The air is pulled through openings in the front cover and
the mass storage devices and is pushed through the PCI card cage. Perforations between and
above the PCI card cage enable proper exhaust ventilation to maintain the required temperature
rating of the PCI cards.
CAUTION:
For maximum cooling effects, ensure that the chassis ventilation holes are not
blocked or covered after installation.
shows the airflow through the server.
Environmental Specifications
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Summary of Contents for rp4410
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