Extreme Networks Summit 200-24, Hardware Installation Manual

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38 Extreme Networks Consolidated "i" and "e" Series Hardware Installation Guide
Site Preparation
Excessive temperature can cause various symptoms to appear on a unit. Once a system has failed due to
overheating, it should be carefully monitored to ensure that a system component or module has not
been compromised. The following symptoms can indicate additional problems that require further
analysis:
• Checksum errors: Increased temperature can damage sensitive components resulting in an increased
degradation of internal circuit reliability. This could result in errors being reported within the switch
fabric itself. Checksum errors of various types (e.g., p-bus, int, external, CPU) can start appearing in
small quantities at temperatures in excess of 40° C as reported by ExtremeWare commands.
• System reboot: The system may reboot to recover to a normal state based on the hardware
configuration. A reboot considered in isolation is not a common symptom of temperature damage;
however, viewed in conjunction with excessive error reporting it may indicate such damage.
Rebooting can occur if checksum errors result in an interruption of core switch command processing.
• Decreased System Reliability: While immediate issues may not arise on system recovery, an
overheating condition within a system may affect the system’s long-term reliability.
Electrostatic Discharge ( ESD)
Your system must be protected from static electricity. Take the following measures to ensure optimum
system performance:
• Keep relative humidity at 50 to 70%.
• Remove materials that can cause electrostatic generation (such as synthetic resins) from the wiring
closet. Check the appropriateness of floor mats and flooring.
• Connect conductors (metals, etc.) to ground, using dedicated grounding lines.
• Use electrostatically safe equipment and the ESD straps that are provided with your equipment. All
Alpine and BlackDiamond switches come with ESD wrist strap connectors and wrist straps as
shown in Figure 7.