I-26
EPSON
S1C6S3N2 TECHNICAL HARDWARE
CHAPTER 4: PERIPHERAL CIRCUITS AND OPERATION (Oscillation Circuit)
As Figure 4.3.1 indicates, the crystal oscillation circuit can
be configured simply by connecting the crystal oscillator
(X'tal) between terminals OSC1 and OSC2 to the trimmer
capacitor (C
GX
) between terminals OSC1 and V
DD
.
In the S1C6S3N2 Series, the S1C6S3A2 has twin clock
specification. The mask option enables selection of either
the CR or ceramic oscillation circuit (OSC3 oscillation cir-
cuit) as the CPU's subclock. Because the oscillation circuit
itself is built-in, it provides the resistance as an external
element when CR oscillation is selected, but when ceramic
oscillation is selected both the ceramic oscillator and two
capacitors (gate and drain capacitance) are required.
Figure 4.3.2 is the block diagram of the OSC3 oscillation
circuit.
4.3
OSC3 oscillation
circuit
OSC1 oscillation
circuit
Oscillation Circuit
The S1C6S3N2 Series has a built-in crystal oscillation
circuit. As an external element, the OSC1 oscillation circuit
generates the operating clock for the CPU and peripheral
circuitry by connecting the crystal oscillator (Typ. 32.768
kHz) and trimmer capacitor (5–25 pF).
Figure 4.3.1 is the block diagram of the OSC1 oscillation
circuit.
Fig. 4.3.1
OSC1 oscillation circuit
V
DD
C
GX
X'tal
OSC2
OSC1
R
FX
R
DX
C
DX
V
DD
To CPU and
peripheral circuits
S1C6S3N2 Series
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