ROC364 Instruction Manual
2-20
Master Controller Unit, I/O Module Rack, and Wiring
Rev Jun/05
2.6 ROC364 Specifications
ROC364 Specifications
PROCESSOR MEMORY
NEC V25+ running at 8 MHz.
On-Board:
128 KB battery-backed SRAM for data.
32 KB EEPROM for configuration.
FlashPAC:
Plug-in module with 512 KB Flash read-
only memory (ROM) and 512 KB of battery-backed
static RAM (SRAM).
Memory Reset:
Optional LDP permits a cold start
initialization when used during power-up.
I/O CAPACITY
Up to 16 I/O channels per Module Rack. Up to 4
Module Racks (64 I/O channels) per MCU.
OPERATOR INTERFACE PORT
EIA-232D (RS-232D) serial format for use with
portable operator interface. Baud is selectable from
300 to 19,200 bps. Asynchronous format, 7 or 8-bit
(software selectable). Parity can be odd, even, or
none (software selectable). 9-pin, female D-shell
connector provided.
TIME FUNCTIONS
Clock Type:
32 kHz crystal oscillator with regulated
supply, battery-backed. Year/Month/Day and
Hour/Minute/Second.
Clock Accuracy:
0.01%.
Watchdog Timer:
Hardware monitor expires after
1.2 seconds and resets the processor. Processor
restart is automatic.
DIAGNOSTICS
These values are monitored: real-time clock/system
clock compare, AI module mid-scale voltage, DI
module default status, AO module D/A voltage, DO
module latch value, I/O transmitter voltage, power
input voltage, MCU board temperature.
POWER REQUIREMENTS
11 to 16 V dc (12.5 V to start up) or 22 to 30 V dc
(25 V to start up), jumper selectable. 1 Watt typical,
excluding I/O power.
AUXILIARY OUTPUT POWER
Input power is software switched to two sets of
auxiliary output power terminals. Each output fused
for 5 A maximum. Output voltage is 0 to 2 V dc less
than input voltage, depending on load.
I/O POWER CONVERTER (OPTIONAL)
Input:
11 to 16 V dc, 15 mA with no load or shorted
output.
Output:
22 to 24 V dc, up to 0.6 A for transmitter
power.
ENVIRONMENTAL
Operating Temperature:
–40° to 70°C (–40° to
158°F).
Storage Temperature:
–50° to 85°C (–58° to
185°F).
Operating Humidity:
To 95%, non-condensing.
Transient Protection:
Meets IEEE C37.90.1-1989.
EMI Immunity:
Meets EN61000-4-5 Performance
Criterion B for Industrial Locations.
EMI Emissions:
Meets FCC 47 CFR, Part 15,
Subpart J, Class A verified.
DIMENSIONS
MCU:
51 mm D by 203 mm H by 305 mm W (2 in.
D by 8 in. H by 12 in. W). Add 38 mm (1.5 in.) to
depth dimension for memory modules.
Module Rack:
13 mm D by 127 mm H by 305 mm
D (0.5 in. D by 5 in. H by 12 in. W).
MCU w/one Module Rack:
311 mm W by 356 mm
H (12.25 in. W by 14 in. H).
MCU w/two Module Racks:
311 mm W by 565
mm H (12.25 in. W by 22.25 in. H).
MCU w/three or four Module Racks:
311 mm W
by 743 mm H (12.25 in. W by 29.25 in. H).
WEIGHT
MCU:
2.3 kg (5 lbs) nominal.
Module Rack:
0.5 kg (1 lb) nominal.
Backplate:
1.4 to 3 kg (3 to 6.5 lbs).
ENCLOSURE
MCU metal chassis with 2-piece cover and Module
Rack case meet NEMA 1 rating.
BACKPLATE
16 gauge steel.
APPROVALS
Approved by CSA for hazardous locations Class I,
Division 2, Groups A, B, C, and D.
