Embedded Solutions
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Construction and Reliability
PCIe Modules while commercial in nature can be conceived and engineered for rugged
industrial environments. PCIeIP is constructed out of 0.062 inch thick High Temp FR4
material.
Surface mount components are used. Most devices are high pin count compared to
mass of the device. For high vibration environments inductors and other higher mass
per joint components can be glued down.
Conformal Coating is an option. For condensing environments conformal coating is
required.
ROHS processing is an option. Standard lead solder is used unless “-ROHS” is added
to the part number.
Thermal Considerations
The PCIeIP design consists of CMOS circuits. The power dissipation due to internal
circuitry is very low. With the one degree differential temperature to the solder side of
the board external cooling is easily accomplished.
