Baldor MicroFlex e100, Installation Manual

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Basic Installation 3-5 MN1942
3.2.2 Mounting and cooling the MicroFlex
e
100
Ensure you have read and understood the
Mechanical installation and location requirements
in
section 3.2. Mount the MicroFlex
e
100 vertically on its rear side, the side opposite the front panel.
M5 bolts or screws should be used to mount the MicroFlex
e
100. Detailed dimensions are shown
in section 3.2.1.
For effective cooling, the MicroFlex
e
100 must be mounted upright on a smooth vertical metal
surface. The MicroFlex
e
100 is designed to operate in an ambient temperature of 0 °C to 45 °C
(32 °F to 113 °F). Output current must be derated between 45 °C (113 °F) and the absolute
maximum ambient temperature of 55 °C (131 °F). Within the ambient temperature range:
The 3 A model is designed to operate without any additional cooling methods.
The 6 A and 9 A models require a forced air flow, passing vertically from the bottom to the top of
the MicroFlex
e
100 case, to allow full rated current at 45 °C (113 °F).
Temperature derating characteristics are shown in sections 3.2.3 to 3.2.5.
Note: Failure to meet cooling air flow requirements will result in reduced product lifetime
and/or drive overtemperature trips. It is recommended to check periodically the
operation of the cooling equipment. Optional fan tray FAN001-024, mounted exactly
as shown in section A.1.1., ensures that correct cooling is provided and allows the
MicroFlex
e
100 to be UL listed.
3.2.2.1 Effects of mounting surface and proximity
The proximity of the MicroFlex
e
100 to other
components could affect cooling efficiency. If
the MicroFlex
e
100 is mounted beside another
MicroFlex
e
100 (or other obstruction), there
should be a minimum space of 15 mm to
maintain effective cooling.
If the MicroFlex
e
100 is mounted above or
below another MicroFlex
e
100 (or other
obstruction), there should be a minimum space
of 90 mm to maintain effective cooling.
Remember that when a MicroFlex
e
100 is
mounted above another MicroFlex
e
100 or
heat source, it will be receiving air that has
been already heated by the device(s) below it.
Multiple MicroFlex
e
100 units mounted above
each other should be aligned, not offset, to
promote air flow across the heatsinks.
The derating characteristics assume the
MicroFlex
e
100 is mounted on 3 mm thick (or
less) metal plate. If the MicroFlex
e
100 is
mounted on 10 mm plate then the current
characteristics shown in sections 3.2.3 to 3.2.5
may be increased by up to 7% if there is no
forced air cooling, or 15% if forced air cooling
is present.
It is recommended to allow approximately
60 mm at the front to accommodate wiring and
connectors.
F
or
ced
ai
r
flow
Fan Fan
15 mm
15 mm
90 mm
Figure 2 - Cooling and proximity
Metal backplane
C
ool
W
ar
m
H
ot