CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U16898EJ3V0UD
373
Table 25-1. Surface Mounting Type Soldering Conditions (2/2)
20-pin plastic SSOP (lead-free products)
µ
PD78F9221MC(T)-5A4-A, 78F9222MC(T)-5A4-A, 78F9221MC(T2)-5A4-A
Note 1
, 78F9222MC(T2)-5A4-A
Note 1
,
µ
PD78F9221MC(S)-5A4-A, 78F9222MC(S)-5A4-A, 78F9221MC(R)-5A4-A, 78F9222MC(R)-5A4-A,
µ
PD78F9221MC(A)-5A4-A
Note 1
, 78F9222MC(A)-5A4-A
Note 1
, 78F9221MC(A2)-5A4-A
Note 1
,
µ
PD78F9222MC(A2)-5A4-A
Note 1
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 260
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: 3 times or less, Exposure limit: 7 days
Note 2
(after that, prebake at 125
°
C for
20 hours)
IR60-207-3
Wave soldering
For details, contact an NEC Electronics sales representative.
−
Partial heating
Pin temperature: 350
°
C max., Time: 3 seconds max. (per pin row)
−
Notes 1.
Under development
2.
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).