6 Removal and Replacement
6.2 ESD Guidelines for HPMM and IOP Cards
R688
HPM High-Performance Process Manager Service
403
December 2020
Honeywell
ESD prevention rules
When installing a firmware upgrade, or replacing or adding a card, adhere to the following rules to
prevent ESD from affecting the HPMM or IOP cards.
Ground the antistatic work surface to the card file chassis.
Ground the wriststrap that is to be worn when removing or inserting card to the card file chassis.
Ground the wriststrap that is to be worn when upgrading card firmware to the antistatic work
surface.
When removing, or inserting a card, handle only the card frame. Do not touch the circuit board or
the components.
The 10 megaohm static discharge probe must be grounded to the card file chassis.
When inserting a card, insert the card 3/4 of the way into the slot and then discharge the card with
the 10 megaohm static discharge probe by touching the lower lead of the upper LED, or if there is a
daughter board, touch the minus/lower lead of the bypass capacitor labeled C1 or C2.
Ensure that the IOP card is in IDLE state before it is removed/replaced from the card file.
Содержание HPM
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