1 OVeRVieW
S1C17624/604/622/602/621 TeChniCal Manual
Seiko epson Corporation
1-15
Chip (S1C17602/621)
Y
X
(0, 0)
3.856 mm
3.900 mm
N.C.
SeG1
N.C.
SeG2 SeG3 SeG4 SeG5 SeG6 SeG7 SeG8 SeG9 SeG10 SeG11 SeG12 SeG13 SeG14 SeG15 SeG16 SeG17 SeG18 SeG19 SeG20 SeG21 SeG22 SeG23 SeG24
N.C.
SeG25
N.C.
aV
DD
V
SS
P15(eXCl3)
/AIN5
P14(eXCl2)
/AIN6
P13(eXCl1)
/AIN7
N.C.
P12
/SIN0
N.C.
P11
/SOUT0
P10
/SCLK0
P07
/#SPISS0
P06
/SDI0
P05
/SDO0
P04
/SPICLK0
P03
/#ADTRG
P02(eXCl0) P01
/REMI
N.C.
P00
/REMO
N.C.
#ReSeT #TeST OSC1 OSC2 V
D1
V
SS
OSC3 OSC4 V
DD
V
SS
V
C1
V
C2
V
C3
Ca
CB
N.C.
N.C.
N.C.
COM0
COM1
COM2
COM3
SeG39/COM4
SeG38/COM5
SeG37/COM6
SeG36/COM7
SeG35
SeG34
SeG33
SeG32
SeG31
SeG30
SeG29
SeG28
N.C.
SeG27
N.C.
SeG26
N.C.
SCLK1/AIN4/
P16
AIN3/
P17
AIN2/
P20
AIN1/
P21
AIN0/
P22
V
DD
SENB0/
P23
SENA0/
P24
REF0/
P25
RFIN0/
P26
V
SS
N.C.
SOUT1/RFIN1/
P27
SIN1/REF1/
P30
SCL0/SENA1/
P31
SDA0/SENB1/
P32
SCL1/SCL0/
P33
SDA1/SDA0/
P34
FOUT1/#BFR/
P35
TOUT3/RFCLKO/
P36
TOUTN3/LFRO/TOUT4/
P37
N.C.
FOUTH/
P40
P41/
DSiO
P42/
DST2
N.C.
P43/
DClK
N.C.
SeG0
N.C.
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
Die No.
CJ602D
***
3.4.3 S1C17602/621 Pad Configuration Diagram
Figure 1.
Chip size
X = 3.900 mm, Y = 3.856 mm
Pad opening
No. 1 to 29, 60 to 88: X = 87 µm, Y = 85 µm
No. 30 to 59, 89 to 118: X = 85 µm, Y = 87 µm
Chip thickness 400 µm