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1. Functional Overview > Overview
22
Tsi574 User Manual
June 6, 2016
Integrated Device Technology
www.idt.com
Figure 1: Block Diagram
The Tsi574 can be used in many embedded communication applications. It provides chip-to-chip
interconnect between I/O devices and can replace existing proprietary backplane fabrics for
board-to-board interconnect which improves system cost and product time-to-market.
Figure 2: Processor Farm Mezzanine Diagram
80B803B_BK001_03
Up to 2 Serial RapidIO Ports - 1x/4x Mode
or
Up to 4 Serial RapidIO Ports - 1x Mode
Up to 2 Serial RapidIO Ports - 1x/4x Mode
or
Up to 4 Serial RapidIO Ports - 1x Mode
Enhanced Internal
Switching Fabric
Registers
Multicast
Engine
JTAG
I 2 C
SP0
(4x or 1x)
SP1
(1x only)
SP4
(4x or 1x)
SP5
(1x only)
SP2
(4x or 1x)
SP3
(1x only)
SP6
(4x or 1x)
SP7
(1x only)
Master and
Slave Devices
IEEE1149.6 Boundary Scan
80B803B_TA001_01
Dual
Serial
RapidIO
DSP
DSP
Tsi574