Clocking
6-6
Intel
®
810A3 Chipset Design Guide
6.4
Capacitor Sites
Intel recommends 0603 package capacitor sites placed as close as possible to the clock input
receivers for AC tuning for the following signal groups:
•
GMCH
•
Processor
•
SDRAM/DCLK
•
3V66
•
3V66 to the ICH0/ICH
6.5
Clock Power Decoupling Guidelines
Several general layout guidelines should be followed when laying out the power planes for the
CK810 clock generator.
•
Isolate power planes to the each of the clock groups.
•
Place local decoupling as close to power pins as possible and connect with short, wide traces
and copper.
•
Connect pins to appropriate power plane with power vias (larger than signal vias).
•
Bulk decoupling should be connected to plane with 2 or more power vias.
•
Minimize clock signal routing over plane splits.
•
Do not route any signals underneath the clock generator on the component side of the board.
•
An example signal via is a 14 mil finished hole with a 24–26 mil path. An example power via
is an 18 mil finished hole with a 33–38 mil path. For large decoupling or power planes with
large current transients it is recommended to use a larger power via.
Figure 6-3. Example of Capacitor Placement Near Clock Input Receiver
CPU BCLK
CPU BCLK
GMCH HTCLK
GMCH HTCLK
GMCH SCLK
GMCH SCLK
Summary of Contents for 810A3
Page 1: ...Intel 810A3 Chipset Platform Design Guide July 2000 Order Number 298186 002...
Page 11: ...1 Introduction...
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Page 25: ...2 PGA370 Processor Design Guidelines...
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Page 41: ...3 SC242 Processor Design Guidelines...
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Page 51: ...4 Layout and Routing Guidelines...
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Page 93: ...5 Advanced System Bus...
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Page 115: ...6 Clocking...
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Page 123: ...7 System Design Considerations...
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Page 137: ...8 Design Checklist...
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Page 157: ...9 Third Party...
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Page 163: ...A PCI Devices Functions Registers Interrupts...