Advanced System Bus Design
5-4
Intel
®
810A3 Chipset Design Guide
5.1.3.3
Monte Carlo Analysis
Perform a Monte Carlo analysis to refine the passing solution space region. A Monte Carlo analysis
involves randomly varying parameters (independent of one another) over their tolerance range.
This analysis intends to ensure that no regions of failing flight time and signal quality exists
between the extreme corner cases run in pre-layout simulations. For the example topology, vary the
following parameters during Monte Carlo simulations:
•
Lengths L1 through L3
•
Termination resistance R
TT
on the processor cartridge #1
•
Termination resistance R
TT
on the processor cartridge #2
•
Z
0
of traces on processor cartridge #1
•
Z
0
of traces on processor cartridge #2
•
S
0
of traces on processor cartridge #1
•
S
0
of traces on processor cartridge #2
•
Z
0
of traces on baseboard
•
S
0
of traces on baseboard
•
Fast and slow corner processor I/O buffer models for cartridge #1
•
Fast and slow corner processor I/O buffer models for cartridge #2
•
Fast and slow package models for processor cartridge #1
•
Fast and slow package models for processor cartridge #2
•
Fast and slow corner 82810 GMCH I/O buffer models
•
Fast and slow 82810 GMCH package models
5.1.3.4
Simulation Criteria
Accurate simulations require that the actual range of parameters be used in the simulations. Intel
has consistently measured the cross-sectional resistivity of the PCB copper to be approximately
1
Ω
*mil
2
/inch, not the 0.662
Ω
*mil
2
/inch value for annealed copper that is published in reference
material. Using the 1
Ω
*mil
2
/inch value may increase the accuracy of lossy simulations.
Positioning drivers with faster edges closer to the middle of the network typically results in more
noise than positioning them towards the ends. However, Intel has shown that drivers located in all
positions (given appropriate variations in the other network parameters) can generate the worst-
case noise margin. Therefore, Intel recommends simulating the networks from all driver locations,
and analyzing each receiver for each possible driver.
Analysis has shown that both fast and slow corner conditions must be run for both rising and
falling edge transitions. The fast corner is needed because the fast edge rate creates the most noise.
The slow corner is needed because the buffer’s drive capability will be a minimum, causing the V
OL
to shift up, which may cause the noise from the slower edge to exceed the available budget. Slow
corner models may produce minimum flight time violations on rising edges if the transition starts
from a higher V
OL
. So, Intel highly recommends checking for minimum and maximum flight time
violations with both the fast and slow corner models. The fast and slow corner I/O buffer models
are contained in the processor and Intel 810A3 chipset electronic models provided by Intel.
The transmission line package models must be inserted between the output of the buffer and the net
it is driving. Likewise, the package model must also be placed between a net and the input of a
receiver model. Editing the simulator’s net description or topology file generally does this.
Summary of Contents for 810A3
Page 1: ...Intel 810A3 Chipset Platform Design Guide July 2000 Order Number 298186 002...
Page 11: ...1 Introduction...
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Page 25: ...2 PGA370 Processor Design Guidelines...
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Page 41: ...3 SC242 Processor Design Guidelines...
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Page 51: ...4 Layout and Routing Guidelines...
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Page 93: ...5 Advanced System Bus...
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Page 115: ...6 Clocking...
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Page 123: ...7 System Design Considerations...
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Page 137: ...8 Design Checklist...
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Page 157: ...9 Third Party...
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Page 163: ...A PCI Devices Functions Registers Interrupts...