Intel
®
810A3 Chipset Design Guide
vii
4-35
RAMDAC Component and Routing Guidelines ..........................................4-34
4-36
Recommended RAMDAC Reference Resistor Placement and
Connections ................................................................................................4-35
4-37
Recommended LC Filter Connection..........................................................4-36
4-38
Frequency Response (see
Table 4-13
).......................................................4-38
5-1
PICD[1,0] Uni-Processor Topology...............................................................5-7
5-2
Test Load vs. Actual System Load ...............................................................5-9
5-3
Aggressor and Victim Networks..................................................................5-11
5-4
Transmission Line Geometry: (A) Microstrip (B) Stripline ...........................5-11
5-5
One Signal Layer and One Reference Plane..............................................5-15
5-6
Layer Switch with One Reference Plane ....................................................5-15
5-7
Layer Switch with Multiple Reference Planes (same type) .........................5-15
5-8
Layer Switch with Multiple Reference Planes .............................................5-16
5-9
One Layer with Multiple Reference Planes.................................................5-16
5-10
Overdrive Region and V
REF
Guardband .....................................................5-19
5-11
Rising Edge Flight Time Measurement.......................................................5-19
6-1
Intel
®
810A3 Chipset Clock Architecture ......................................................6-2
6-2
Different Topologies for the Clock Routing Guidelines .................................6-5
6-3
Example of Capacitor Placement Near Clock Input Receiver.......................6-6
7-1
Intel
®
810A3 Chipset Power Delivery Architecture .......................................7-2
7-2
82810A3 GMCH Power Plane Decoupling ...................................................7-8
7-3
G3-S0 Transistion .........................................................................................7-9
7-4
S0-S3-S0 Transition....................................................................................7-10
7-5
S0-S5-S0 Transition....................................................................................7-11
8-1
Pullup Resistor Example.............................................................................8-15
8-2
PWRGOOD and PWROK Logic .................................................................8-17
Summary of Contents for 810A3
Page 1: ...Intel 810A3 Chipset Platform Design Guide July 2000 Order Number 298186 002...
Page 11: ...1 Introduction...
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Page 25: ...2 PGA370 Processor Design Guidelines...
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Page 41: ...3 SC242 Processor Design Guidelines...
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Page 51: ...4 Layout and Routing Guidelines...
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Page 93: ...5 Advanced System Bus...
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Page 115: ...6 Clocking...
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Page 123: ...7 System Design Considerations...
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Page 137: ...8 Design Checklist...
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Page 157: ...9 Third Party...
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Page 163: ...A PCI Devices Functions Registers Interrupts...